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Electronic Thermal Analysis and Solutions

System Level Technologies Used

• Identification and Recognition of Thermal Loads
z (TC’s and FLIR)

•Use of Air Flow Optimization (CFD)

•Replacement of Existing Thermal Management Systems
zWith More Efficient Systems

•Integration of Intelligent Thermal Management Control

• Verification and Validation of the Applied Solutions at
zDifferent Ambient Conditions and Thermal Loads

Measured Temperature Map Comparisons

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Original Configuration zzzzzModified Configuration

 

Thermal Solution Results Thermal Image Comparisons Open Case Computer

Components temperatures lowered by as much as 15°F afterimprovementsimplemented by Rocky Research

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Originalzzzzzzzzzzzzzzzzzz zzzModified

 

Thermal Solution Results NEMA Box Sealed
Computer Baseline and Modification Results

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