Rocky Research Technologies.
Heat Transfer and Electronics Cooling.
Electronic Thermal Analysis and Solutions
System Level Technologies Used
- Identification and Recognition of Thermal Loads (TC’s and FLIR)
- Use of Air Flow Optimization (CFD)
- Replacement of Existing Thermal Management Systems With More Efficient Systems
- Integration of Intelligent Thermal Management Control
- Verification and Validation of the Applied Solutions at Different Ambient Conditions and Thermal Loads
Measured Temperature Map Comparisons
charts
Original Configuration Modified Configuration
Thermal Solution Results Thermal Image Comparisons Open Case Computer
Components temperatures lowered by as much as 15°F
after
improvements implemented by Rocky Research
Original Modified
Thermal Solution Results NEMA Box Sealed Computer Baseline and Modification Results
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